[Example of Problem Solving] Chip Manufacturer
We will introduce examples of implementing heat-resistant fragile chip mounting, low thermal stress mounting, and large chip mounting.
We would like to introduce a case study of our response to chip manufacturers. Even though they developed high-performance and high-functionality chips for sensors, high-speed communication, processors, etc., they faced challenges such as not having a subcontractor for implementation to realize those functions, being unable to implement thermally fragile chips, and being unable to implement large-area chips. As a result, we carried out implementations for thermally fragile chips, low thermal stress implementations, and large chip implementations. [Case Overview (Excerpt)] ■ Implementation of thermally fragile chips - Achieved implementation of a 140°C heat-resistant magnetic sensor array ■ Low thermal stress implementation - Achieved implementation of a 40mm ultrasonic MEMS sensor chip *For more details, please refer to the PDF document or feel free to contact us.
- Company:コネクテックジャパン
- Price:Other